SUNNYVALE, CA – Synopsys has officially completed its acquisition of Ansys, finalizing a deal first announced in January of last year. The move combines Synopsys’ strengths in silicon design and IP ...

A step-down PCB is simply a multilayer PCB whose board thickness is reduced (stepped down) in a few places. The step-down is ...

SANTA ANA, CA – TTM Technologies has announced the acquisition of a 750,000 sq. ft. facility in Eau Claire, WI, and land rights for a new manufacturing site in Penang, Malaysia.

WASHINGTON – Global semiconductor sales reached $59 billion in May, a 27% year-over-year increase, according to data released today by the Semiconductor Industry Association (SIA). Sales were up 3.5% ...

Yole Group forecasts the advanced IC substrate market to reach $31B by 2030, fueled by AI, glass core substrates, and demand for complex high-performance packaging.

GBM finalizes Lincstech acquisition to boost AI server PCB capabilities, expanding operations in Singapore and Malaysia to support growth in advanced tech sectors.

Global wrist-worn device shipments rose 10.5% year-over-year in Q1 2025, driven by strong demand across key regions, with Huawei, Xiaomi, and Apple leading the market, according to IDC.

AllSpice.io raises $15 million in Series A funding to scale enterprise features and launch its AI Agent, advancing automation and collaboration for electrical engineering teams.

Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.

North American PCB shipments surged 21.4% year-over-year in May 2025, driven by strong demand and improved supply chains, according to IPC.