Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: Localizing a three-dimensional (3D) source using linear arrays (LAs) is a promising new localization technology. Existing solutions are either designed for specific LA deployments, are ...
Aerospace giant Boeing has unveiled a new approach to solar array substrates that could dramatically speed up satellite production. By using 3D printing, the aerospace company says it can reduce ...
National Engineering Research Center for High Efficiency Grinding, State Key Laboratory of Advanced Design and Manufacturing Technology for Vehicle, College of Mechanical and Vehicle Engineering, ...
EL SEGUNDO, Calif., Sept. 10, 2025 /PRNewswire/ -- Boeing (BA) [NYSE: BA] unveiled a 3D‑printed solar array substrate approach that compresses composite build times by up to six months on a typical ...
WASHINGTON — Boeing announced it has begun 3D printing the structural panels that form the backbone of satellite solar arrays, a step the aerospace giant says will cut production times in half and ...
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