The 3D-printing hype ended years ago, but the threat of tariffs and the closing of the de minimis exemptions means that making your own stuff might actually hold some value. We break down the pros and ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
The project employs YOLOv11, a state-of-the-art object detection model, in conjunction with Ultralytics' ObjectCounter for accurate vehicle detection and counting. The pre-trained model weights ...
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