A lack of planarity along the interface between the solder and the ceramic raft in an IGBT module is a common anomaly that can make heat dissipation uneven across the die and cause the die to crack.
Wilsonville, OR. Mentor Graphics today announced a new MicReD Power Tester 600A product, which tests electric and hybrid vehicle (EV/HEV) power electronics reliability during power cycling. The MicReD ...
TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that beginning February 15 it will provide samples of its new LV100-type 1.2-kV IGBT module as an industrial-use ...
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