Consumer demand is driving the need for ever-faster silicon chips, also known as integrated circuits (ICs) or semiconductors.

Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

May 2014 – Si2 announces new thermal interface protocol standard for 3D Integrated Circuits. The Chip Thermal Interface Protocol (CTIP) facilitates the exchange of thermal design information required ...

The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of ...

As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...

The benefits of thermal interface materials. Comparing FR-4 laminate with insulated metal substrate (IMS) PCB. How phase-change TIMs may prove to be the best solution. One of the most important—and ...

The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controller integrated circuits and storage solutions, today entered into the high-speed ...

A dc-dc converter is an electric circuit that converts a source of direct current (dc) from one voltage level to another by storing the input energy temporarily and then releasing that energy to the ...