The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
ASE Technology (NYSE:ASX) delivers semiconductor assembly, testing, and IC packaging services, supporting engineering, supply ...
Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...
Ottawa, Dec. 05, 2025 (GLOBE NEWSWIRE) -- According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance Computing ...
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...
In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...
Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
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